米乐M6

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Competitiveness for Next-Generation Data Centers and Artificial Intelligence
The amount of data is growing explosively in frontier applications of data center and artificial intelligence. The enterprise-level solutions of high-speed connectivity, thermal management, and power management creatively developed by Luxshare not only meet the stringent requirements for high speed, broad bandwidth, and high reliability, but also excel at reducing energy consumption, empowering a "green AI data center"
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    Light Active Devices
    Upgrades from traditional design and functions of active devices by leveraging idle resources in the system, reducing energy consumption and cost for "green data center"
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    Thermal Management
    Data center-oriented thermal management solutions are being constantly innovated and developed, lowering PUE value of data center comprehensively through efficient cooling mechanism and precise power management, and thus lowering data center's operational cost
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    Xuanyuan Platform
    Dedicated to basic research, interface innovation, and precision manufacturing of high-speed connectivity product. The company has patents and self-developed, scalable core technologies ranging from interface to internal design

Data Center Solutions

An integration of cloud computing and network management provides clients with an enterprise-level end-to-end connectivity solution stretching through full life cycle
Back to Scenario Overview
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Solution for Inter-Cabinet Connection

Solution Package for Inside Cabinet

Solution Package for Server

Solution Package for Switch

  • Solution for Inter-Cabinet Connection
  • Solution Package for Inside Cabinet
  • Solution Package for Server
  • Solution Package for Switch
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Electrical Connection

Optical Connection

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    Electrical Connection
    Interconnection scheme among external DAC, ACC and AEC cabinets
    Back to Scenario Overview
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    Optical Connection
    Interconnection scheme among external AOC, optical module and optical cable cabinets
    Back to Scenario Overview
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Electrical Connection

Optical Connection

Thermal Management

  • 32.png
    Electrical Connection
    Interconnection scheme among external DAC, ACC and AEC devices
    Back to Scenario Overview
  • 42.png
    Optical Connection
    Interconnection scheme among external AOC, optical module and optical cable cabinets
    Back to Scenario Overview
  • 38.png
    Thermal Management
    Water cooling board, CDU overall solution
    Back to Scenario Overview
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Internal High-speed Cable

High Speed Connector

Thermal Management

Power Management

FIO

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    Internal High-Speed Cable
    Internal high-speed interconnection product solution
    Back to Scenario Overview
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    High Speed Connector
    Internal high-speed interconnection product solution
    Back to Scenario Overview
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    Thermal Management
    Server cooling product solution
    Back to Scenario Overview
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    Power management
    Universal redundant server power supply to meet the mainstream server power supply architecture
    Back to Scenario Overview
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    FIO
    Server modular ear hanging scheme
    Back to Scenario Overview
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Internal High-Speed Cable

High Speed Connector

CPO

Thermal Management

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    Internal High-Speed Cable
    Interconnection scheme of switching equipment
    Back to Scenario Overview
  • 44.png
    High Speed Connector
    Interconnection scheme of switching equipment
    Back to Scenario Overview
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    CPO
    Co-package optical solution
    Back to Scenario Overview
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    Thermal Management
    Solution of heat dissipation products for switches
    Back to Scenario Overview
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  • Solution for Inter-Cabinet Connection

    • 18.png
      Electrical Connection
      Interconnection scheme among external DAC, ACC and AEC cabinets
    • 28.png
      Optical Connection
      Interconnection scheme among external AOC, optical module and optical cable cabinets
  • Solution Package for Inside Cabinet

    • 32.png
      Electrical Connection
      Interconnection scheme among external DAC, ACC and AEC devices
    • 42.png
      Optical Connection
      Interconnection scheme among external AOC, optical module and optical cable cabinets
    • 38.png
      Thermal Management
      Water cooling board, CDU overall solution
  • Solution Package for Server

    • 9.png
      Internal High-Speed Cable
      Internal high-speed interconnection product solution
    • 3.png
      High Speed Connector
      Internal high-speed interconnection product solution
    • 4056.png
      Thermal Management
      Server cooling product solution
    • 2000-1.jpg
      Power management
      Universal redundant server power supply to meet the mainstream server power supply architecture
    • 14.png
      FIO
      Server modular ear hanging scheme
  • Solution Package for Switch

    • 54.png
      Internal High-Speed Cable
      Interconnection scheme of switching equipment
    • 44.png
      High Speed Connector
      Interconnection scheme of switching equipment
    • 63.png
      CPO
      Co-package optical solution
    • 61.png
      Thermal Management
      Solution of heat dissipation products for switches
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  • 11+

    Manufacturing bases
  • 15+

    Independent laboratories
  • 1000+

    Patents
  • 15000+

    Employees
Want to Learn More?
Work with our team of professionals to customize your data center solution to meet your requirements
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